COB Light Strip Manufacturing Process And Light Source Packaging Process Explained

COB Light Strip Manufacturing Process And Light Source Packaging Process Explained

Introduction

COB light strips are a new type of high-brightness, high-visibility linear light strip. They have a beautiful appearance, uniform and soft light without spots, and a high waterproof rating of IP67. They use flip-chip packaging technology for good heat dissipation, low heat, and long life. They are the preferred products in the modern home lighting market. So, what is the manufacturing process of COB light strips? How is the COB light source packaged? Let’s take a detailed look below.

COB Light Strip Manufacturing Process

Tools: LED chips, solder paste, PCB circuit board, fluorescent powder, silicone, terminals, back glue, reels, flip-chip solid crystal machine, reflow soldering, dispensing machine, testing equipment, welding machine, mixer.

Step by Step of COB Strip light production process

1. First, apply solder paste to the PCB solder pad using an automatic solder paste machine. The uniformity and thickness of the solder paste determine the quality and flatness of the soldered chip.
2. Load the PCB board coated with solder paste onto the carrier, input the solid crystal program through computer programming, and adjust the direction and height of the solid crystal.
3. Perform a small batch of solid crystal tests and inspect the appearance quality of the solid crystal PCB to determine the direction of the solid crystal and whether the position is correct.
4. Place the solid crystal PCB and chip into reflow soldering, set the temperature and speed of reflow soldering, and solder the LED chip firmly in reflow soldering.
5. After testing the LED chips on the PCB board, perform the powder mixing process of silicone and fluorescent powder.
6. Fix the PCB board on the dispensing machine carrier for dispensing. After dispensing, put the PCB board into the oven for baking.
7. Test the photoelectric parameters of the light strip after dispensing.
8. Solder the 0.5-meter PCB board and connect it into 5-10 meters as required; package the light strip well with back glue after soldering.
9. Turn to mass production after small batch testing shows no abnormalities.

DoWell Lighting COB Light Source Packaging Process Explained Below

First Step: Crystal Expansion

A machine is used to uniformly expand the entire LED chip film provided by the manufacturer, making it easier to puncture the closely arranged LED grains on the film surface.

Second Step: Back Glue

Place the expanded crystal ring on a machine that has a scraped silver paste layer, and apply silver paste.

Third Step: Puncture Crystal

Place the crystal ring, which has been prepared with silver paste, into a puncture frame. The operator then uses a puncture pen under a microscope to puncture the LED chip onto the PCB printed circuit board.

Fourth Step: Curing Silver Paste

Place the PCB board with the punctured crystal into a thermal cycle oven for a set period, allowing the silver paste to cure. (Note: Do not leave it for too long, as the LED chip coating may oxidize.)

Fifth Step: Chip Adhesion

Use a dispensing machine to apply an appropriate amount of red or black glue at the IC position on the PCB printed circuit board. Then, use anti-static equipment to correctly place the IC bare chip on the glue.

Sixth Step: Drying

Place the board with the adhered bare chip into a thermal cycle oven for a set period, or allow it to naturally cure over a longer time.

Seventh Step: Wire Bonding

Use an aluminum wire welding machine to bridge the chip (either LED grain or IC chip) with the corresponding solder pad on the PCB board.

Eighth Step: Preliminary Testing

Use specialized testing tools to check the COB board and repair any boards that do not meet the standards.

Ninth Step: Dispensing

Use a dispensing machine to apply a prepared AB glue appropriately onto the bonded LED grains. ICs are packaged with black glue, followed by exterior packaging as per customer requirements.

Tenth Step: Curing

Place the PCB board with the sealed glue into a thermal cycle oven for a set period, based on different drying time requirements.

Eleventh Step: Final Testing

Use specialized testing tools to perform electrical performance tests on the packaged PCB printed circuit board, distinguishing good from bad.

Frequently Asked Questions

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What Tools are Required for Manufacturing COB Light Strips?

The essential tools for manufacturing COB light strips include LED chips, solder paste, PCB circuit boards, fluorescent powder, silicone, terminals, back glue, and specialized machinery like flip-chip solid crystal machines and reflow soldering machines.

How is the Quality of Soldering Determined in COB Light Strips?

The quality and flatness of the soldered chip are determined by the uniformity and thickness of the solder paste applied to the PCB solder pad.

What is the Importance of Solid Crystal Testing in COB Light Strip Manufacturing?

Solid crystal testing is crucial for inspecting the appearance quality of the solid crystal PCB, confirming the direction of the solid crystal, and ensuring the correct position of the solid crystal.

What is the Role of Reflow Soldering in COB Light Strip Production?

Reflow soldering is used to firmly solder the LED chip onto the PCB board. The temperature and speed of reflow soldering are set to ensure a strong bond.

What is Crystal Expansion in COB Light Source Packaging?

Crystal expansion is the first step in COB light source packaging. It involves using a machine to uniformly expand an entire LED chip film, making it easier to puncture the closely arranged LED grains.